General Controller SiP ( System In Package )

General Controller SiP ( System In Package )

Based on the target of the next generation of hardware platform miniaturization, high integration and generalization, adopts the HTCC integration process, integrated a total of 25 chips. It is mainly used in satellite control system.
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Product Details

1.Product introduction

CXPM01311 is based on the target of the next generation of hardware platform miniaturization, high integration and generalization, It is mainly used in satellite control system.

2.Product Parameters

1

Processor

C6701 DSP

2

Programmable logic resource

XC2V3000 FPGA

3

Internal ADC

16Bit400MSPS

4

Internal DAC

12Bit150MSPS

5

Number of PWM channel

12 Channels

6

RS422 Interface

4 Transmitter 4 Receiver

7

Package form

CPGA467

8

Package size

60mm*60mm*10mm

9

Working frequency

100MHz

10

Working temperature

-55125

3.Product features and applications

HTCC integrate construction

12 channel motor drive circuits

Inner 3 million programmable gates

Inner C6701 DSP

Inner high speed ADC and DAC

Space borne antenna field applications

Satellite measurement and control field applications

4.Product details

The product adopts the double cavity air tightness package HTCC integration process, internal integration FPGA, DSP, interface chips, motor drive control circuits, such as a total of 25 chips. To realize the function of complex systems of high density integration, high performance data processing ability and as many as 12 channel motor drive signal output function. It is mainly used in satellite control system.


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